ltcc

Some of the fabrication techniques that I am working on are:

1) Jet Vapor Etching: Binder Extraction

2) Chemical etching using photolithography:

3) Exfoliation: High Temperature Pressure Sensor

4) Photoformable Tapes

Machining and processing of Low Temperature Co-fired Ceramics. Prevention of sagging, machining in the green and
fired state. Photolitographic process for LTCC. Fabrication of pressure and flow transducers.

I have been working in this topic in my Ph.D. Thesis and it is part of a larger project.

Main characteristics of the Green Tapes v/s silicon:

	LTCC	Silicon
Physical Characteristics:
Flexural Strength	320MPa	350Mpa
Thermal Conductivity	3.0W/mK
Surface Smoothness	0.22 um	~nm
Young’s Modulus	152Gpa	131Gpa
Thermal expansion coeff.	5.8ppm/K	~6.7ppm/K
Standard Process
Standard Via Diameter Resolution	100 um*	<1um

* I have been able to reduce this number to 70 um.
This tapes can be used to fabricate meso-channels and reservorios for transport and analysis of fluids.

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